Micron Technology, Inc.
Manufacturing · Primarily ID · PERM filings 2017–2024
Overview
Micron Technology, Inc. is a Manufacturing employer that has filed 717 PERM green-card applications between FY2017 and FY2024. That places it #90 among all U.S. PERM sponsors in our dataset. 455 were certified (63.5% approval rate), taking about 288 days on average. The most-sponsored role is Electronics Engineers, Except Computer, with most worksites in ID, and the median sponsored wage is $105,000.
717
PERM filings
63.5%
approval
8
denied
$105,000
median wage
288d
avg processing
Worker background
Across 525 filings with beneficiary data, the most common country of origin is INDIA (60%). (From legacy PERM form data, FY2020–FY2024.)
Top countries of origin
- India313
- China96
- Taiwan20
- Singapore10
- Nigeria10
- South Korea10
- Philippines8
- Japan8
- Malaysia5
- Bangladesh5
Prior visa status
- H-1B409
- F-158
- L-146
- O-14
- H-43
- TN3
- Not in USA1
- B-21
Education
- Master's373
- Bachelor's88
- Doctorate57
- None5
- Other2
PERM filings by year
Occupations & job titles
The occupations Micron Technology, Inc. most often sponsors, with average wages.
| Occupation | Filings | Avg wage |
|---|---|---|
| Electronics Engineers, Except Computer | 208 | $122,694 |
| Electrical Engineers | 114 | $107,325 |
| Industrial Engineers | 87 | $94,263 |
| Materials Engineers | 32 | $102,744 |
| Chemical Engineers | 32 | $97,305 |
| Software Developers, Systems Software | 27 | $128,563 |
| Computer Systems Analysts | 26 | $115,797 |
| Mechanical Engineers | 24 | $95,704 |
| Software Developers, Applications | 21 | $97,158 |
| Validation Engineers | 16 | $112,970 |
Common job titles
Recent filings
| Case | Job title | Status | Worksite | Decision |
|---|---|---|---|---|
| G-100-24066-777314 | Demand Analyst | Certified | Boise, ID | Jul 11, 2025 |
| G-100-24060-760049 | Senior Engineer - NAND PI | Certified | Boise, ID | Jun 24, 2025 |
| G-100-24058-751726 | Engineer - DEG PE | Certified | Boise, ID | Jun 24, 2025 |
| G-100-24054-742917 | IT Solution Architect - PLM | Certified | Boise, ID | Jun 23, 2025 |
| G-100-24299-434371 | Engineer-Dry Etch-DRAM/EM | Withdrawn | BOISE, ID | Mar 20, 2025 |
| G-100-24311-457313 | ATSM Network Supply Manager, Controller | Withdrawn | San Jose, CA | Mar 7, 2025 |
| G-100-24164-101941 | Applications Engineer | Withdrawn | Boise, ID | Feb 13, 2025 |
| G-100-24037-697899 | Engineer, Design Readiness | Withdrawn | Boise, ID | Feb 6, 2025 |
| G-100-24103-882300 | Package Reliability Engineer | Withdrawn | Boise, ID | Feb 5, 2025 |
| G-100-24101-874466 | Process Engineer | Withdrawn | Manassas, VA | Jun 14, 2024 |
| G-100-24095-857025 | DRAM Product Engineer –DFT | Withdrawn | Boise, ID | Apr 4, 2024 |
| A-22363-80673 | Semiconductor Product Engineer | Certified-Expired | Boise, ID | Mar 25, 2024 |
| A-22348-73685 | Firmware Engineer | Certified-Expired | San Jose, CA | Mar 14, 2024 |
| A-22363-80403 | ENGINEER - DEG PE | Certified-Expired | Boise, ID | Mar 4, 2024 |
| A-23012-86766 | DRAM Product Engineer | Certified-Expired | Boise, ID | Mar 4, 2024 |
| G-100-24052-735896 | Senior Semiconductor Product Engineer | Withdrawn | Boise, ID | Feb 28, 2024 |
| A-22339-67612 | Principal SSD Firmware Test Engineer | Certified-Expired | San Jose, CA | Feb 28, 2024 |
| A-23011-85706 | Semiconductor Product Engineer | Certified-Expired | Boise, ID | Feb 28, 2024 |
| A-23010-85037 | DEG Design Engineer | Certified-Expired | Boise, ID | Feb 21, 2024 |
| A-22361-79669 | IT Solution Architect | Certified-Expired | Boise, ID | Feb 21, 2024 |
Source: U.S. DOL OFLC PERM disclosure data. Wages are annual-equivalent; outliers excluded.