Intel Corporation
Manufacturing · Primarily CA · PERM filings 2012–2025
Overview
Intel Corporation is a Manufacturing employer that has filed 7,553 PERM green-card applications between FY2012 and FY2025. That places it #5 among all U.S. PERM sponsors in our dataset. 3,990 were certified (52.8% approval rate), taking about 285 days on average. The most-sponsored role is Electronics Engineers, Except Computer, with most worksites in CA, and the median sponsored wage is $108,888.
7,553
PERM filings
52.8%
approval
62
denied
$108,888
median wage
285d
avg processing
Worker background
Across 6,045 filings with beneficiary data, the most common country of origin is INDIA (72%). (From legacy PERM form data, FY2020–FY2024.)
Top countries of origin
- India4,360
- China309
- Bangladesh223
- Taiwan128
- Nigeria124
- South Korea96
- Mexico94
- Nepal75
- Canada74
- Sri Lanka64
Prior visa status
- H-1B3,062
- F-12,364
- L-1375
- H-471
- TN62
- O-161
- L-217
- Not in USA9
Education
- Master's3,957
- Doctorate1,572
- Bachelor's502
- Other14
PERM filings by year
Occupations & job titles
The occupations Intel Corporation most often sponsors, with average wages.
| Occupation | Filings | Avg wage |
|---|---|---|
| Electronics Engineers, Except Computer | 2,458 | $111,069 |
| Materials Engineers | 1,835 | $100,501 |
| Software Developers, Systems Software | 936 | $110,276 |
| Software Developers | 870 | $135,362 |
| Computer Hardware Engineers | 279 | $131,897 |
| Industrial Engineers | 213 | $99,796 |
| Architectural and Engineering Managers | 102 | $171,592 |
| Statisticians | 96 | $99,356 |
| Computer and Information Research Scientists | 83 | $147,724 |
| Sales Engineers | 54 | $125,326 |
Common job titles
Wage range
$93,038
25th
$108,888
median
$128,234
75th
$150,000
90th
Law firms used
- Fragomen, Del Rey, Bernsen Loewy, LLP5,667
- Fragomen, Del Rey, Bernsen & Loewy LLP1,508
- Fragomen, Del Rey, Bernsen and Loewy, LLP376
- 7500 N. Dreamy Draw Drive1
- Fragomen, Del Ray, Bernsen Loewy, LLP1
Recent filings
| Case | Job title | Status | Worksite | Decision |
|---|---|---|---|---|
| A-21138-87875 | Security Researcher | Certified - Expired | Hillsboro, OR | Nov 15, 2022 |
| A-21145-91300 | Engineering Manager - Component Design | Certified - Expired | Santa Clara, CA | Nov 15, 2022 |
| A-21140-89276 | Engineering Manager - Component Design | Certified - Expired | Santa Clara, CA | Nov 15, 2022 |
| A-21117-78826 | Engineering Manager – Component Design | Certified - Expired | Santa Clara, CA | Nov 15, 2022 |
| A-21204-21379 | Software Engineer | Certified - Expired | Chandler, AZ | Nov 14, 2022 |
| A-21195-16880 | Software Engineer | Certified - Expired | Chandler, AZ | Nov 14, 2022 |
| A-21274-52702 | Hardware Engineer | Certified - Expired | Austin, TX | Nov 14, 2022 |
| A-21182-11054 | Component Design Engineer | Certified - Expired | Hillsboro, OR | Nov 14, 2022 |
| A-21195-16709 | Component Design Engineer | Certified - Expired | Hillsboro, OR | Nov 14, 2022 |
| A-21211-24832 | Component Design Engineer | Certified - Expired | Folsom, CA | Nov 14, 2022 |
| A-21342-83032 | Component Design Engineer | Certified - Expired | Santa Clara, CA | Nov 14, 2022 |
| A-22012-96763 | Component Design Engineer | Certified - Expired | Hudson, MA | Nov 14, 2022 |
| A-22153-64683 | Component Design Engineer | Withdrawn | Santa Clara, CA | Nov 14, 2022 |
| A-21195-16790 | Process Engineer | Certified - Expired | Hillsboro, OR | Nov 14, 2022 |
| A-21312-69423 | Packaging Engineer - Materials | Certified - Expired | Aloha, OR | Nov 14, 2022 |
| A-21215-26188 | Packaging Engineer - Mechanical | Certified - Expired | Chandler, AZ | Nov 14, 2022 |
| A-22140-58274 | Process Engineer | Withdrawn | Hillsboro, OR | Nov 10, 2022 |
| A-22139-57656 | Software Engineer | Withdrawn | Hillsboro, OR | Nov 10, 2022 |
| A-22209-96051 | Packaging Engineer - Materials | Withdrawn | Chandler, AZ | Nov 3, 2022 |
| A-22189-85047 | Process Engineer | Withdrawn | Hillsboro, OR | Nov 2, 2022 |
Source: U.S. DOL OFLC PERM disclosure data. Wages are annual-equivalent; outliers excluded.