G-100-23219-243666
WithdrawnJob
- Job title
- Packaging Engineer - Materials
- SOC
- —
- Wage
- $122,500–$187,350 / Year
Employer & worksite
- Employer
- Intel Corporation
- Worksite
- Hillsboro, OR
- Attorney
- Fragomen, Del Rey, Bernsen & Loewy LLP
Timeline
- Received
- Aug 7, 2023
- Decision
- Feb 1, 2024
- Processing days
- 178
Source
- Quarter
- FY2024_Q4
- NAICS
- 3344
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